The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7068514 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 27, 2006

Filed:

Feb. 18, 2004
Applicants:

Chi-lin Chang, Taipei, TW;

Hui-min Tsui, Taipei, TW;

Inventors:

Chi-Lin Chang, Taipei, TW;

Hui-Min Tsui, Taipei, TW;

Assignee:

CPUMATE Inc., Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The protection structure has a bottom surface to cover the thermal conducting medium, a side wall extending along and projecting from a periphery of the bottom surface to form a space for receiving the thermal conducting medium and a portion of the heat dissipation device, and a support structure protruding from the bottom surface to avoid a direct contact between the thermal conducting medium and the bottom surface.


Find Patent Forward Citations

Chang, Chi-Lin. (2006). Protection structure for thermal conducting medium of heat dissipation device (U.S. Patent No. 7068514). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7068514

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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