The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Mar. 27, 2003
Thomas H. Koschmieder, Austin, TX (US);
Terry E. Burnette, New Braunfels, TX (US);
Thomas H. Koschmieder, Austin, TX (US);
Terry E. Burnette, New Braunfels, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Improved electro-mechanical connections between a packaged semiconductor die () and a printed circuit board () with reduced standoff height and pitch are created by the use of a non-planar semiconductor package substrate () having a surface with angulated portions. Electrically conductive surfaces () are formed over the angulated portions. In one embodiment, the electrically conductive surfaces may be formed by forming an electrically conductive surface () over a non-planar or angulated package substrate (). The electrically conductive angulated surfaces improve reliability of solder joints () upon connecting the packaged semiconductor die to the printed circuit board (). The gaps within the solder mask openings provide a thin profile and improved pitch. In one form, the die may be on a same side of the package as the angulated substrate surface.