The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Nov. 06, 2003
Takeshi Tachibana, Kobe, JP;
Kazushi Hayashi, Kobe, JP;
Kenichi Inoue, Kobe, JP;
Yoshihiro Yokota, Kobe, JP;
Koji Kobashi, Kobe, JP;
Nobuyuki Kawakami, Kobe, JP;
Takashi Kobori, Kobe, JP;
Takeshi Tachibana, Kobe, JP;
Kazushi Hayashi, Kobe, JP;
Kenichi Inoue, Kobe, JP;
Yoshihiro Yokota, Kobe, JP;
Koji Kobashi, Kobe, JP;
Nobuyuki Kawakami, Kobe, JP;
Takashi Kobori, Kobe, JP;
Kabushiki Kaisha Kobe Seiko Sho, Hyogo, JP;
Abstract
A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat spreader is directly formed on a substrate for the semiconductor device. In particular, the heat spreader is composed of a diamond layer and one or two metal or ceramic members, which are bonded to the diamond layer with one or two polymer adhesive layers. This diamond layer has a fiber structure across the thickness or a microcrystalline structure. Cilia are formed on a surface of the diamond layer facing the one or two metal or ceramic members.