The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Feb. 13, 2003
Masaaki Hatano, Yokohama, JP;
Hiroshi Ikegami, Hiratsuka, JP;
Takamasa Usui, Fujisawa, JP;
Mie Matsuo, Kamakura, JP;
Masaaki Hatano, Yokohama, JP;
Hiroshi Ikegami, Hiratsuka, JP;
Takamasa Usui, Fujisawa, JP;
Mie Matsuo, Kamakura, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device comprising a substrate, a plurality of dielectric films formed on the substrate, laid one upon another, and a fuse interconnect-wire formed above the substrate and covered with a predetermined one of the dielectric films, and including a fuse main body which is to be blown to electrically disconnect the fuse interconnect-wire, which is smaller than a bottom of a fuse-blowing recess made in the predetermined dielectric film, which has a length not less than the diameter of a fuse-blowing laser beam and which opposes the bottom of the fuse-blowing recess.