The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Oct. 03, 2003
Kenneth Paul Zarnoch, Scotia, NY (US);
John Robert Campbell, Clifton Park, NY (US);
Glen David Merfeld, Loudonville, NY (US);
John Austin Rude, Ballston Lake, NY (US);
Prameela Susarla, Clifton Park, NY (US);
Michael Alan Vallance, Loudonville, NY (US);
Gary William Yeager, Rexf rd, NY (US);
Kenneth Paul Zarnoch, Scotia, NY (US);
John Robert Campbell, Clifton Park, NY (US);
Glen David Merfeld, Loudonville, NY (US);
John Austin Rude, Ballston Lake, NY (US);
Prameela Susarla, Clifton Park, NY (US);
Michael Alan Vallance, Loudonville, NY (US);
Gary William Yeager, Rexf rd, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.