The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Oct. 10, 2002
Applicant:
Hiroshi Ohara, Shiojiri, JP;
Inventor:
Hiroshi Ohara, Shiojiri, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electroless plating apparatus includes: a storage tank for an electroless plating solution; a blocking member which blocks the electroless plating solution from flowing from a treatment side of a semiconductor wafer installed to the storage tank toward an opposite side to the treatment side, the treatment side being a side facing the electroless plating solution; and a solution supplier which causes the electroless plating solution to flow so that the electroless plating solution comes in contact with the treatment side of the semiconductor wafer.