The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Mar. 29, 2002
Applicants:
Masao Kubota, Hitachi, JP;
Takeshi Ohashi, Hitachi, JP;
Tatsuya Ichikawa, Hitachi, JP;
Inventors:
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 μm; or a photosensitive layer having a thickness of 0.1 to 14 μm and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.
Quick Actions:
Kubota, Masao. (2006). Photosensitive film for circuit formation and process for producing printed wiring board (U.S. Patent No. 7067226). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7067226
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile