The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Mar. 06, 2003
Naotaka Sasaki, Kiryu, JP;
Shunichi Kawamata, Kiryu, JP;
Kenji Sugaya, Kiryu, JP;
Hideaki Ito, Kiryu, JP;
Naotaka Sasaki, Kiryu, JP;
Shunichi Kawamata, Kiryu, JP;
Kenji Sugaya, Kiryu, JP;
Hideaki Ito, Kiryu, JP;
Japan Servo Co., Ltd., Tokyo, JP;
Abstract
A wasteless type lamination system comprises a first transfer device for transferring along a first transfer path a continuous laminate film; a cutter for cutting the continuous laminate film in a predetermined length, provided beside the first transfer path at the downstream of the first transfer device; a second transfer device for transferring along the first transfer path a cut laminate film; a film detection sensor for detecting a leading edge of the continuous laminate film, provided beside the first transfer path at the downstream of the cutter; a card transfer device for transferring a card along a second transfer path; and a thermocompression bonding device for laminating the cut laminate film to the card. The continuous laminate film is moved backward from the cutter by a predetermined distance by the first transfer device before or after cutting action of the cutter.