The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Jul. 08, 2003
Hsing-sheng Liang, San Jose, CA (US);
Michael Chern, San Jose, CA (US);
Hong Huynh, Fremont, CA (US);
Phillip Ting, San Jose, CA (US);
Saeed Seyed, Los Altos Hills, CA (US);
Hsing-Sheng Liang, San Jose, CA (US);
Michael Chern, San Jose, CA (US);
Hong Huynh, Fremont, CA (US);
Phillip Ting, San Jose, CA (US);
Saeed Seyed, Los Altos Hills, CA (US);
Cisco Technology, Inc., San Jose, CA (US);
Abstract
A heat sink attachment mechanism includes a fastener having an associated compressible member. The fastener defines a flange that, as the fastener secures a heat sink to a circuit board component, is configured to contact a circuit board surface associated with the circuit board component. Contact between the flange and the circuit board minimizes the travel of the fastener relative to the circuit board component and limits the stress generated on the circuit board component or on the solder balls of a ball grid array associated with the circuit boards component by the heat sink. Also, as the fastener secures the heat sink to the circuit board component, the fastener compresses the compressible member against the heat sink, thereby causing the compressible member to expand. Expansion of the compressible member allows the compressible member to absorb changes in the stress applied by the fastener to the heat sink and circuit board component over time.