The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Jan. 21, 2003
Takuya Takahashi, Sakata, JP;
Hiroyuki Tomimatsu, Sakata, JP;
Takuya Takahashi, Sakata, JP;
Hiroyuki Tomimatsu, Sakata, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile