The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Nov. 08, 2001
Moldability modifier for polypropylene resin and polypropylene resin composition containing the same
Yukihito Zanka, Mie, JP;
Mitsuhiro Murayama, Mie, JP;
Yoshiharu Yamamoto, Mie, JP;
Japan Polychem Corporation, Tokyo, JP;
Abstract
The invention provides a polypropylene based resin composition, which has good moldability on injection molding and which is excellent in its flow mark appearance as well as weld appearance on molding, and suitable for injection-molded articles such as exterior parts of automobiles, and also provides a moldability modifier used for the composition. The invention is a moldability modifier for a polypropylene based resin, which comprises at least one of a propylene homopolymer and a propylene random polymer having die swell ratio of 1.5 to 2.5 and ratio (Q value: Mw/Mn) of 7 to 13 of the weight average molecular weight (Mw) to the number average molecular weight (Mn) measured by gel permeation chromatography (GPC). The moldability modifier is mixed with a propylene-ethylene block copolymer, an ethylenic or styrenic elastomer, an inorganic filler, etc. to prepare a polypropylene based resin composition.