The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Mar. 03, 2003
Hisashi Mogi, Futtsu, JP;
Naruhiko Nomura, Futtsu, JP;
Shigenobu Koga, Futtsu, JP;
Masahiro Fujikura, Futtsu, JP;
Shuichi Yamazaki, Futtsu, JP;
Hisashi Mogi, Futtsu, JP;
Naruhiko Nomura, Futtsu, JP;
Shigenobu Koga, Futtsu, JP;
Masahiro Fujikura, Futtsu, JP;
Shuichi Yamazaki, Futtsu, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
The present invention provides a method for indirect-electrification-type continuous electrolytic etching of a metal strip suitable for producing a low-core-loss, grain-oriented silicon steel sheet not susceptible to the deterioration of core loss after stress-relief annealing, and an apparatus for the indirect-electrification-type continuous electrolytic etching. It is a method for indirect-electrification-type continuous electrolytic etching of a metal strip and an apparatus for the same for continuously forming grooves by indirect-electrification-type electrolytic etching on a metal strip on which an etching mask is formed in etching patterns on one or both surfaces, wherein: plural electrodes of an A series and a B series are arranged alternatively, at least in a pair, in said order in the travelling direction of the metal strip so that they face the surface to be etched of the metal strip on which the etching patterns are formed; the space between the metal strip and the group of the electrodes is filled with an electrolyte; and voltage is applied across the A series and B series electrodes.