The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
May. 23, 2005
Applicants:
Fang-xiang Yu, Shenzhen, CN;
Meng-tzu Lee, Tu-Cheng, TW;
Shu-ho Lin, Tu-Cheng, TW;
Inventors:
Assignee:
HON HAI Precision Industry Co., LTD, Tu-cheng, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat dissipation device includes a heat sink (), thermal interface material () spread on a bottom surface () of the heat sink, two legs () of a clip () disposed at opposite sides of the heat sink, and a protective cap () enclosing the thermal interface material therein. The protective cap includes ears () interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member () on a printed circuit board () thereby firmly mounting the heat sink to a CPU () on the printed circuit board.