The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
May. 24, 2001
Naoki Saito, Ibaraki, JP;
Masayuki Kozawa, Chiyoda-ku, JP;
Shinya Igarashi, Ibaraki, JP;
Hiromu Kikawa, Ibaraki, JP;
Akio Yasukawa, Chiyoda-ku, JP;
Akira Takasago, Chiyoda-ku, JP;
Naoki Saito, Ibaraki, JP;
Masayuki Kozawa, Chiyoda-ku, JP;
Shinya Igarashi, Ibaraki, JP;
Hiromu Kikawa, Ibaraki, JP;
Akio Yasukawa, Chiyoda-ku, JP;
Akira Takasago, Chiyoda-ku, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Car Engineering Co., Ltd., Hitachinaka, JP;
Abstract
A heating resistor type flow measuring device comprising a housing having a support part provided between a frame body and a connector and connected to the mounting part of a fluid passage, a flow rate detection element held on the frame body side of the housing, and an electronic circuit held on the housing and connected electrically to the flow rate detection element and the connector, wherein the electronic circuit is held on the frame body side of the housing and positioned in the fluid passage, a member with the rigidity higher than the material of the main structural member of the housing is formed integrally with the support part, the housing is fixed to the fluid passage through the member with high rigidity. A metal plate is inserted into the support part so as to increase rigidity. Further, a distance is provided between the support part and a metal plate forming a route for conducting the heat transferred to the metal base fixing an electronic circuit substrate by a plastic mold so as to form a structure obstructing a heat transfer, or a clearance is provided in a portion spaced by the plastic mold between the support part and the metal base so as to form a structure obstructing a heat transfer.