The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Jun. 30, 2003
Ashutosh Joshi, Bangalore, IN;
William Edward Burdick, Jr., Schenectady, NY (US);
Sandeep Shrikant Tonapi, Niskayuna, NY (US);
Joseph Lacey, Cambridge, WI (US);
Ashutosh Joshi, Bangalore, IN;
William Edward Burdick, Jr., Schenectady, NY (US);
Sandeep Shrikant Tonapi, Niskayuna, NY (US);
Joseph Lacey, Cambridge, WI (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object. A detector array comprises a plurality of detector assemblies. A gantry secured to the X-ray radiation source and the detector array rotates around a longitudinal axis. Further, each of the detector assembly comprises a detector subassembly adapted to detect the X-ray beams. These detector subassemblies are further adapted to convert the X-ray beams to a plurality of electrical signals. At least one circuit board assembly is coupled to the detector subassembly. The circuit board assembly typically comprises an integrated circuit array, such as, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array further comprises a plurality of integrated circuit chips, for example, data acquisition chips mounted on at least one printed circuit board. A thermal management system is adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control the thermal environment of each detector assembly. A processor is typically configured to process the electrical signals to generate a plurality of projection measurements. The processor is further adapted to perform computations on the projection measurements to construct an image of the object therefrom.