The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2006

Filed:

Aug. 13, 2003
Applicants:

Michael Zhou, Thousand Oaks, CA (US);

Die-chi Sun, Thousand Oaks, CA (US);

Kee-sin Tan, Westlake Village, CA (US);

Wenbin Jiang, Thousand Oaks, CA (US);

Inventors:

Michael Zhou, Thousand Oaks, CA (US);

Die-Chi Sun, Thousand Oaks, CA (US);

Kee-Sin Tan, Westlake Village, CA (US);

Wenbin Jiang, Thousand Oaks, CA (US);

Assignee:

JDS Uniphase Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.


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