The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2006

Filed:

Dec. 27, 2002
Applicants:

David L. Brunker, Naperville, IL (US);

Daniel L. Dawiedczyk, Naperville, IL (US);

John E. Lopata, Naperville, IL (US);

Arindum Dutta, Warrenville, IL (US);

Inventors:

David L. Brunker, Naperville, IL (US);

Daniel L. Dawiedczyk, Naperville, IL (US);

John E. Lopata, Naperville, IL (US);

Arindum Dutta, Warrenville, IL (US);

Assignee:

Molex Incorporated, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An engineered transmission line for transmitting high-frequency data signals between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.


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