The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Jun. 11, 2002
Applicant:
Hiroshi Ikegami, Hiratsuka, JP;
Inventor:
Hiroshi Ikegami, Hiratsuka, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device is disclosed, which comprises a semiconductor substrate, an interlayer insulation film formed above the semiconductor substrate, a fuse formed on or in the interlayer insulation film, and a wiring layer formed in a portion of the interlayer insulation film, which is under the fuse, the wiring layer being isolated from the fuse and having a width smaller than the fuse.