The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
May. 22, 2003
Applicants:
Harry E. Eaton, Woodstock, CT (US);
Ellen Y. Sun, South Windsor, CT (US);
Stephen Chin, Wallingford, CT (US);
Inventors:
Harry E. Eaton, Woodstock, CT (US);
Ellen Y. Sun, South Windsor, CT (US);
Stephen Chin, Wallingford, CT (US);
Assignee:
United Technologies Corporation, Hartford, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); F03B 3/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bond layer for use on a silicon based substrate. The bond layer comprises an alloy comprising a refractory metal disilicide/silicon eutectic. The refractory metal disilicide is selected from the group consisting of disilicides of molybdenum, chromium, hafnium, niobium, tantalum, rhenium, titanium, tungsten, uranium, vanadium, yttrium and mixtures thereof. The refractory metal disilicide/silicon eutectic has a melting point of greater than 1300° C.