The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2006

Filed:

Jun. 08, 2002
Applicants:

Matthias Fuertsch, Gomaringen, DE;

Frank Fischer, Gomaringen, DE;

Lars Metzger, Albstadt, DE;

Frieder Sundermeier, Reutlingen, DE;

Inventors:

Matthias Fuertsch, Gomaringen, DE;

Frank Fischer, Gomaringen, DE;

Lars Metzger, Albstadt, DE;

Frieder Sundermeier, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a mass flow sensor having a layered structure on the upper side of a silicon substrate (), and having at least one heating element () patterned out of a conductive layer in the layered structure, thermal insulation between the heating element () and the silicon substrate () is achieved by way of a silicon dioxide block () which is produced beneath the heating element () either in the layered structure on the silicon substrate () or in the upper side of the silicon substrate (). As a result, the sensor can be manufactured by surface micromechanics, i.e. without wafer back-side processes.


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