The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2006

Filed:

Dec. 09, 2002
Applicants:

Masahiro Morikawa, Hachioji, JP;

Kazuo Shiozawa, Hachioji, JP;

Kazumi Furuta, Hachioji, JP;

Yuichi Akanabe, Tokyo, JP;

Osamu Masuda, Hachioji, JP;

Inventors:

Masahiro Morikawa, Hachioji, JP;

Kazuo Shiozawa, Hachioji, JP;

Kazumi Furuta, Hachioji, JP;

Yuichi Akanabe, Tokyo, JP;

Osamu Masuda, Hachioji, JP;

Assignee:

Konica Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/00 (2006.01); B29D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of producing an optical element forming die, includes the steps of: cutting a base member to form a base optical surface of the base member while rotating the base member; cutting an outer circumferential surface of the base member so that an optical axis of the base optical surface is identical to a rotation center of the outer circumferential surface of the base member while rotating the base member; forming an optical surface having a predetermined pattern onto the base optical surface of the base member; forming an electroforming mold having an optical transfer surface complementary to the optical surface of the base member by electroforming wherein the electroforming is conducted with the base member; and cutting an outer circumferential surface of the electroforming mold on the basis of the outer circumferential surface of the base member.


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