The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Jul. 30, 2001
Masayuki Yamamoto, Osaka, JP;
Minoru Ametani, Osaka, JP;
Masayuki Yamamoto, Osaka, JP;
Minoru Ametani, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape T to a protective tape P on the surface of the semiconductor wafer W. An edge memberis placed in contact with the surface of the peeling tape T and run along the protective tape P. The peeling tape T is peeled as being folded back by a large angle of 90 degrees or more at the tip of edge member. The protective tape P is peeled and removed along with the peeling tape T from the surface of the wafer. As a result, the unwanted substance is removed with high precision without breaking the wafer W.