The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2006

Filed:

Nov. 06, 2003
Applicants:

Hiroyuki Yoshida, Wakayama, JP;

Toshiya Hagihara, Wakayama, JP;

Ryoichi Hashimoto, Wakayama, JP;

Yasuhiro Yoneda, Wakayama, JP;

Inventors:

Hiroyuki Yoshida, Wakayama, JP;

Toshiya Hagihara, Wakayama, JP;

Ryoichi Hashimoto, Wakayama, JP;

Yasuhiro Yoneda, Wakayama, JP;

Assignee:

Kao Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.


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