The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Mar. 06, 2003
Naotoshi Shino, Chiba, JP;
Yutaka Wakabayashi, Chiba, JP;
Kazuyoshi Tominaga, Chiba, JP;
SII Printek Inc., Chiba, JP;
Abstract
To prevent corrosion and disconnection of an anisotropic conductor film due to ink and ink vapor and to eliminate discharge defects in an ink jet print head having a structure in which a head chip and a circuit substrate for driving the head chip are interconnected by an FPC substrate through the anisotropic conductor film, an outer periphery of the interconnecting portion is molded throughout a full range by a sealant so as to cut off the interconnecting portion from external air. The sealant is of an epoxy type, a silicone type or an acrylic type. An epoxy sealant having low viscosity (50 pa·s or below) and high hardness (85 or more: JISA standard) is used for a first layer sealant of the interconnecting portion and a silicone sealant having high viscosity (70 pa·s or more) is used for a second layer sealant to achieve a two-layered molding structure.