The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2006

Filed:

Jul. 22, 2004
Applicants:

Nicholas Bundza, Nepean, CA;

Fabien Letourneau, Aylmer, CA;

Gregory William Cheshire, Woodlawn, CA;

Inventors:

Nicholas Bundza, Nepean, CA;

Fabien Letourneau, Aylmer, CA;

Gregory William Cheshire, Woodlawn, CA;

Assignee:

Alcatel, , FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); H05K 7/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

An assembly of releasably interconnected circuit substrates is provided. The assembly has a first and second circuit substrate. Each substrate provides an electrical connector for mating electrical engagement of the first and second substrates. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.


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