The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Dec. 18, 2003
Yasuhiro Naka, Tokyo, JP;
Naotaka Tanaka, Tokyo, JP;
Ikuo Yoshida, Tokyo, JP;
Satoshi Imasu, Tokyo, JP;
Takahiro Naito, Tokyo, JP;
Yasuhiro Naka, Tokyo, JP;
Naotaka Tanaka, Tokyo, JP;
Ikuo Yoshida, Tokyo, JP;
Satoshi Imasu, Tokyo, JP;
Takahiro Naito, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.