The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Nov. 08, 2002
Helmut Sautter, Ditzingen, DE;
Frank Schatz, Kornwestheim, DE;
Juergen Graf, Stuttgart, DE;
Hans Artmann, Magstadt, DE;
Udo-martin Gomez, Leonberg, DE;
Kersten Kehr, Zwota, DE;
Helmut Sautter, Ditzingen, DE;
Frank Schatz, Kornwestheim, DE;
Juergen Graf, Stuttgart, DE;
Hans Artmann, Magstadt, DE;
Udo-Martin Gomez, Leonberg, DE;
Kersten Kehr, Zwota, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A semiconductor component, in particular a micromechanical pressure sensor based on silicon, having a base layer, an at least largely self-supporting diaphragm and an overlayer situated on the diaphragm, the diaphragm and the base layer, at least from place to place, delimiting a void. Furthermore, at least from place to place, above the diaphragm a conducting region is provided in the overlayer which is electrically poorly conductive as compared to the conducting region, to which the surface of the diaphragm that faces the overlayer is able to be electrically contacted.