The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Dec. 26, 2000
Toshiharu Seyama, Kurashiki, JP;
Mitsuhiro Horio, Kurashiki, JP;
Toshiharu Seyama, Kurashiki, JP;
Mitsuhiro Horio, Kurashiki, JP;
Asahi Kasei Kabushiki Kaisha, Osaka, JP;
Abstract
A polyoxymethylene resin composition, which comprises (A) 100 parts by weight of polyoxymethylene resin, (B) 0.01 to 5 parts by weight of at least one polymer selected from homopolymers of N-vinylcarboxylic acid amides and copolymers of N-vinylcarboxylic acid amides and other vinyl monomers, and (C) 0.01 to 5 parts by weight of at least one compound selected from the group consisting of polyalkylene glycol and its derivatives, fatty acid amides, esters of alcohols and fatty acids, and esters of alcohols and dicarboxylic acids. Such a polyoxymethylene resin composition has a small amount of released formaldehyde gas during production and molding and suppressed scorching generation and is also distinguished in the water resistance and repeated impact resistance of the resulting moldings.