The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Nov. 20, 2003
Applicants:
Stephen P. Cole, Winooski, VT (US);
William J. Murphy, North Ferrisburgh, VT (US);
Barbara A. Waterhouse, Richmond, VT (US);
Inventors:
Stephen P. Cole, Winooski, VT (US);
William J. Murphy, North Ferrisburgh, VT (US);
Barbara A. Waterhouse, Richmond, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bond pad upon which a wirebond interconnection is formed, consisting of a first bond pad layer formed on a chip, and a second bond pad layer formed on the first bond pad layer, wherein the first bond pad layer is more resistant to removal than the second bond pad layer during probe testing, and the first bond pad layer increases resistance to interconnection failure during mechanical testing.