The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Nov. 15, 2002
Shuichi Ichikawa, Handa, JP;
Naoshi Masukawa, Nishikasugai-gun, JP;
Shuichi Ichikawa, Handa, JP;
Naoshi Masukawa, Nishikasugai-gun, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A honeycomb structure, and a process for production thereof, formed by bonding into one piece via a bonding layer a plurality of honeycomb segments, the honeycomb segment having an outer wall, partition walls provided inside the outer wall, and a large number of through-holes divided by the partition walls and extending in the axial direction of the segment; the outer wall and bonding layer having a relation:*[(κ)+(κ)]≧κ≧*[(κ)+(κ)]×0.6wherein κc (W/mK) and dc (cm) are respectively the thermal conductivity and thickness of the outer wall, κa (W/mK) and da (cm) are respectively the thermal conductivity and thickness of the bonding layer, and κ (W/mK) and d (cm) are respectively the thermal conductivity and thickness of a layer which is the sum of the outer wall and the bonding layer.