The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
May. 20, 2003
Yoshiaki Okuhama, Akashi, JP;
Keigo Obata, Akashi, JP;
Masakazu Yoshimoto, Akashi, JP;
Shingo Kitamura, Akashi, JP;
Seiichiro Nakao, Akashi, JP;
Osamu Masuyama, Kobe, JP;
Hidenori Tsuji, Fujisawa, JP;
Yoshiaki Okuhama, Akashi, JP;
Keigo Obata, Akashi, JP;
Masakazu Yoshimoto, Akashi, JP;
Shingo Kitamura, Akashi, JP;
Seiichiro Nakao, Akashi, JP;
Osamu Masuyama, Kobe, JP;
Hidenori Tsuji, Fujisawa, JP;
Daiwa Fine Chemicals Co., Ltd., Hyogo-ken, JP;
Abstract
A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.