The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Nov. 21, 2002
Akihiko Kobayashi, Chiba Prefecture, JP;
Kazumi Nakayoshi, Chiba Prefecture, JP;
Ryoto Shima, Chiba Prefecture, JP;
Yoshito Ushio, Chiba Prefecture, JP;
Katsutoshi Mine, Chiba Prefecture, JP;
Akihiko Kobayashi, Chiba Prefecture, JP;
Kazumi Nakayoshi, Chiba Prefecture, JP;
Ryoto Shima, Chiba Prefecture, JP;
Yoshito Ushio, Chiba Prefecture, JP;
Katsutoshi Mine, Chiba Prefecture, JP;
Abstract
An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.