The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Aug. 01, 2003
Kouji Takahashi, Gunma, JP;
Kazuhisa Kusano, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Gunma, JP;
Abstract
The overflow of a brazing material () from a die pad () is prevented by forming a second plating film (B) on the surface of the die pad (). The second plating film (B) is provided around the surface of the die padso as to enclose an area where a semiconductor element () is mounted. In a step of mounting the semiconductor element () on the die pad () with the brazing material (), the brazing material () overflows from the first plating film (A) when the semiconductor element () is mounted on the upper part of the molten brazing material. However, the second plating film (B) functions as a blocking area by which the overflow of the brazing material is prevented. Therefore, a short circuit can be prevented from arising between the die pad () and the bonding pad () because of the brazing material that has spread.