The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Mar. 25, 2002
Applicant:
Kazuhiko Terashima, Tokyo, JP;
Inventor:
Kazuhiko Terashima, Tokyo, JP;
Assignee:
Citizen Watch Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A packaged semiconductor device structure comprises a semiconductor chip () having a bump electrode (), a facing substrate () having on one face thereof a facing electrode () contacting an end face of the bump electrode () and a bonding agent () filled in between the semiconductor chip () and the facing substrate (). The bump electrode () is of a double layer structure composed of a core part () and a convex-shaped electrode end part () fabricated above the core part () separately from the core part.