The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Aug. 27, 1999
Michihisa Tasaka, Kawasaki, JP;
Shinzo Saito, Tokyo, JP;
Masaki Nishiguchi, Tokyo, JP;
Hitoshi Yamada, Ichihara, JP;
Dai Hashimoto, Ichihara, JP;
Michihisa Tasaka, Kawasaki, JP;
Shinzo Saito, Tokyo, JP;
Masaki Nishiguchi, Tokyo, JP;
Hitoshi Yamada, Ichihara, JP;
Dai Hashimoto, Ichihara, JP;
Riken Technos Corporation, Tokyo, JP;
Abstract
There is disclosed a fire-retardant resin composition, which comprises: a thermoplastic resin component (A) comprising (a) a block copolymer mainly made of a vinyl aromatic compound and a conjugated diene compound as its constitutional components, and/or a hydrogenated block copolymer of the block copolymer, (b) a nonaromatic-series softener for rubber, (c) an ethylene/α-olefin copolymer, and (d) a polypropylene resin; and (e) an organic peroxide, (f) a (meth)acrylate-series and/or allyl-series crosslinking aid, and a metal hydrate (B), wherein a specific amount of the metal hydrate (B) to be used is a metal hydrate being pretreated with a silane coupling agent, and the fire-retardant resin composition is a mixture of the above formulation that is heated and kneaded at a temperature equal to or higher than the melting temperature of the (A). There is also disclosed a wiring material and other molded parts, in which the resin composition is utilized.