The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Jul. 06, 2004
Applicants:
Visvamohan Yegnashankaran, Redwood City, CA (US);
Gobi R. Padmanabhan, Sunnyvale, CA (US);
Inventors:
Visvamohan Yegnashankaran, Redwood City, CA (US);
Gobi R. Padmanabhan, Sunnyvale, CA (US);
Assignee:
National Semiconductor Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor wafer is diced utilizing a method that etches down to the top surface of the semiconductor wafer a number of times, such as during and following the formation of the metal interconnect structure, and then thins the semiconductor wafer from the back side until the semiconductor wafer singulates.