Methods of fabricating mos field effect transistors with pocket regions using implant blocking patterns

Abstract

MOSFETs with pocket regions are fabricated. A gate electrode layer is formed on a semiconductor substrate; and lightly doped drain regions are formed in the semiconductor substrate adjacent the gate electrode layer. A blocking pattern is formed on the semiconductor substrate where the gate electrode layer is formed. The blocking pattern is adjacent and spaced apart from the gate electrode layer a predetermined distance and exposes portions of the semiconductor substrate adjacent sidewalls of the gate electrode layer. Pocket regions are formed in the semiconductor substrate by implanting impurity ions using the gate electrode layer and the blocking pattern as an ion implantation mask.