The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7052824 B1

PDF
Full Text
Expired
Date of Patent:
May. 30, 2006

Filed:

Jun. 26, 2001
Applicant:

Roupen Leon Keusseyan, Raleigh, NC (US);

Inventor:

Roupen Leon Keusseyan, Raleigh, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.


Find Patent Forward Citations

Keusseyan, Roupen. (2006). Process for thick film circuit patterning (U.S. Patent No. 7052824). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7052824

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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