The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7052772 B1

PDF
Full Text
Expired
Date of Patent:
May. 30, 2006

Filed:

Aug. 14, 2003
Applicants:

Andrew C. Lottes, Austin, TX (US);

Mark A. Roehrig, La Mesa, CA (US);

Inventors:

Andrew C. Lottes, Austin, TX (US);

Mark A. Roehrig, La Mesa, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 18/00 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a material for packaging electronic components. In one embodiment, the packaging material comprises (a) a puncture resistant film having opposed first and second major surfaces; (b) a substantially continuous metal free light transmissible layer disposed on the first surface of the puncture resistant film, wherein the light transmissible layer comprises at least one pair of polymer layer and transparent conductive oxide layer; and (c) a heat sealable layer disposed on the light transmissible layer or on the second surface of the puncture resistant film. Other embodiments are provided.


Find Patent Forward Citations

Lottes, Andrew. (2006). Material for packaging electronic components (U.S. Patent No. 7052772). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7052772

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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