The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2006

Filed:

Dec. 05, 2003
Applicant:

Jose Antonio Cubero Pitel, Tarragon Valls, ES;

Inventor:

Jose Antonio Cubero Pitel, Tarragon Valls, ES;

Assignee:

Lear Corporation, Southfield, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Manufacturing process for manufacturing printed circuit boards from an extruded polymer, comprising the steps:-preparing an electro-conductive plate () and form embossments () by means of selective engraving on a first side (), corresponding to future tracks and depressions () corresponding to future inter-track areas;-applying a dielectric substrate material, in a pasty or semi-pasty state, according to a first sheet () obtained by extrusion of a thermal-plastic material, arranging it on said first side (), covering said embossments () and filling said depressions (), and subjecting the first sheet () and plate () assembly to a predetermined pressure so that the dielectric substrate material completely fills said depressions and encloses said embossments (), and-on the hardened dielectric substrate, carrying out a second selective engraving on a side opposite the first side (), removing the material corresponding to said future inter-track areas.


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