The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Oct. 02, 2003
Applicants:
Hiroshi Osuda, Kasugai, JP;
Toru Matoba, Kasugai, JP;
Masataka Fukuizumi, Kasugai, JP;
Inventors:
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized circulation. The slurry effluent is then regenerated and reused.
Osuda, Hiroshi. (2006). Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors (U.S. Patent No. 7052599). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7052599
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile