Micromachined double tuning-fork gyrometer with detection in the plane of the machined wafer

Abstract

The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer, including two symmetrical moving assemblies coupled by a coupling structure connecting these two assemblies in order to allow transfer of mechanical vibration energy between them, each moving assembly comprising three moving elements, a first inertial moving element intended to vibrate in two orthogonal directions Ox and Oy in the plane of the wafer, a second moving element intended to vibrate along Oy and connected to the first moving element and to fixed anchoring zones, by first linking means which allow the vibration movement of the first moving element along Oy to be transmitted to the second moving element without permitting movement of the second element along the Ox direction and a third moving element intended to vibrate along Oy and connected to the second moving element and to fixed anchoring zones by second linking means which allow the vibration movement of the second moving element along Oy to be transmitted, in phase opposition, to the third moving element.