The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Aug. 26, 2004
Henry Wong, Tempe, AZ (US);
Dale C. Blankenship, Chandler, AZ (US);
John H. Kelly, Phoenix, AZ (US);
Dennis E. Liles, Chandler, AZ (US);
Naufel C. Naufel, Tempe, AZ (US);
Charles C. Hill, Gilbert, AZ (US);
Henry Wong, Tempe, AZ (US);
Dale C. Blankenship, Chandler, AZ (US);
John H. Kelly, Phoenix, AZ (US);
Dennis E. Liles, Chandler, AZ (US);
Naufel C. Naufel, Tempe, AZ (US);
Charles C. Hill, Gilbert, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An integrated power supply air inlet unit () coupled to slidably insert into a first interspace region () of an embedded computer chassis (), where the first interspace region is defined by a module portion (), a rear surface () and a first side surface (), includes a power supply () coupled to supply power to the embedded computer chassis, and a front surface () that is substantially perpendicular to the first side surface. A cooling air mass () is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular () to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.