The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Apr. 27, 2004
Makiko Nakamura, Tokyo, JP;
Makiko Nakamura, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device includes a fine interconnection structure with low resistance at a through hole. A first interconnection is formed on a surface of a first layer insulating film. The first interconnection is tapered. An insulating layer is formed on the first interconnection and the first insulating film, and has a through hole that exposes an upper surface and a portion of a side surface of the first interconnection. The insulating layer covers a conductive portion of the first interconnection within the through hole. A second interconnection is provided over the insulating layer, and is electrically connected to the first interconnection through the through hole.