The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Apr. 06, 2004
Naoki Ishikawa, Kawasaki, JP;
Shuichi Takeuchi, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
In the method of forming a multi-piled bump, metal balls can be stably and securely piled so as to form the multi-piled bump having a prescribed height. The method of the present invention comprises the steps of: holding a metal wire by a capillary; sparking and melting the wire so as to form metal balls; piling a plurality of the metal balls with applying a load and ultrasonic vibrations thereto, and characterized in that a tail length of the metal wire, which is held by the capillary, is controlled to make a gap between a center of the metal wire and a center of the metal ball one half of a diameter of the metal wire or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile