The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Dec. 01, 2003
Tetsuya Oda, Shiga-ken, JP;
Choichiro Fujii, Takefu, JP;
Etsuo Nishikawa, Kanazawa, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a method of forming a thick-film wiring on a substrate, photosensitive-electroconductive paste is filled into a pattern groove formed on the surface of a light-transmitting intaglio plate. The pattern groove corresponds to a desired thick-film wiring pattern. The photosensitive-electroconductive paste filled in the pattern groove are irradiated with light-rays from the front and back sides of the intaglio plate to cause the paste to harden until the overall peripheral surface of the electroconductive paste has a predetermined hardness. The electroconductive paste hardened in the pattern grooves of the intaglio plate is transferred to an intermediate piece. Then, the electroconductive paste is transferred from the intermediate piece to a substrate. Thereafter, the electroconductive paste is fired, whereby a thick-film wiring is formed on the substrate.