The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2006

Filed:

Oct. 02, 2000
Applicants:

Takehiko Tojo, Tochigi, JP;

Yoshiaki Kumamoto, Tochigi, JP;

Masataka Ishikawa, Tochigi, JP;

Kunio Matsui, Tochigi, JP;

Eiki Kimura, Tochigi, JP;

Koichi Sagara, Tochigi, JP;

Kenichi Otani, Tochigi, JP;

Shingo Odajima, Tochigi, JP;

Tokihito Sono, Tochigi, JP;

Inventors:

Takehiko Tojo, Tochigi, JP;

Yoshiaki Kumamoto, Tochigi, JP;

Masataka Ishikawa, Tochigi, JP;

Kunio Matsui, Tochigi, JP;

Eiki Kimura, Tochigi, JP;

Koichi Sagara, Tochigi, JP;

Kenichi Otani, Tochigi, JP;

Shingo Odajima, Tochigi, JP;

Tokihito Sono, Tochigi, JP;

Assignee:

Kao Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 20/00 (2006.01); B29D 23/00 (2006.01); B32B 1/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A pulp molded container comprising a pulp molded article () having on the inner surface and/or the outer surface thereof a resin layer () with a thickness of 5 to 300 μm formed by applying a coating, wherein the thickness ratio of the resin layer () to the molded article () (former/latter) is 1/2 to 1/100, and the surface roughness profile of the outer or inner surface of the pulp molded article is such that a centerline average roughness (Ra) is 0.5 to 20 μm.


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