The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2006

Filed:

Mar. 14, 2001
Applicants:

Kenichiro Suetsugu, Nishinomiya, JP;

Takaharu Gamo, Fujiidera, JP;

Shunji Hibino, Hirakata, JP;

Yoshio Morita, Suita, JP;

Mikiya Nakata, Suita, JP;

Inventors:

Kenichiro Suetsugu, Nishinomiya, JP;

Takaharu Gamo, Fujiidera, JP;

Shunji Hibino, Hirakata, JP;

Yoshio Morita, Suita, JP;

Mikiya Nakata, Suita, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); B23K 35/34 (2006.01); B23K 28/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed, and the certain object can be more readily detached from the another object after formation of the connecting portion. The connecting material comprises a solder material and a hydrogen storage metal material which is able to occlude hydrogen, and which is in the form of particles dispersed in the connecting material.


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