The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Oct. 10, 2002
Applicant:
Kazuo Arikado, Fukuoka, JP;
Inventor:
Kazuo Arikado, Fukuoka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic component mounting apparatus removes an electronic component supplied to a part feeder in face-up status and mounts it to a board. A flip-chip supplied from a first holding table is removed and flipped over by a take-out head and then delivered to a mounting head, which mounts the component on the board. A die supplied from a second holding table is picked up directly and mounted to the board by the mounting head. This structure allows a single mounting apparatus to perform both die bonding and flip-chip bonding.