The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2006
Filed:
Dec. 23, 2003
Kuniyasu Matsui, Hotaka-machi, JP;
Kuniyasu Matsui, Hotaka-machi, JP;
Seiko Epson Corporation, , JP;
Abstract
A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be readily aligned when they are stacked and terminals can be prevented from being short-circuited, thereby enhancing the reliability of the connection between electrodes of the semiconductor chips. According to the method, semiconductor chips are perforated, and a conductive material such as copper is filled into each perforation, thereby forming a terminal that contains the conductive material and has a recessed portion, disposed in the upper face thereof.